Hermetic Seal, Sealtron and Aegis are part of the AMETEK Engineered Interconnect and Packaging family of brands. We manufacture hermetically sealed connectors and packages that operate in critical aerospace components - engines, landing gear, actuators, electronic equipment, and more.
Our Hermetic Seal brand focuses exclusively on custom connectors, built from the ground up and designed to meet your specific applications.
Our Sealtron brand is an expert in glass-to-metal hermetically sealed connectors manufactured in large volumes and is Qualified Products Listed (QPL).
Aegis produces hermetic glass to metal seal packages for microelectronics in avionics, weapon systems, sensors, guidance and more.
Between our three brands, we offer a full suite of high-performance, precision connectors and packages that are capable of withstanding even the most extreme conditions.
We help OEMs develop connectors for the most demanding aerospace applications. Please complete the form to schedule a time to meet at the Paris Air Show. Our team will be in touch shortly.
Liam is an aerospace industry executive based in Cincinnati, Ohio – with 20+ years of leadership experience in sales and operations management manufacturing highly engineered aerospace components. Liam has a BA in Economics from Murdoch University, and a MBA from Xavier University.
Tim is an aerospace and electronics industry executive, based in Cincinnati, Ohio – with 20+ years of leadership experience in Sales, Marketing and Business Development with a Bachelor of Science in Electrical and Electronic Engineering from Western Michigan University.
Cyrille is an aerospace industry expert, based in Toulouse, France – with 23+ years of experience in Project Management, Business Development and Sales Management with a Masters Degree in Mechanical Engineering from ISMANS CESI and Physics from Université d'Orléans. Cyrille is Fluent in English and French.
Richard is an aerospace interconnect industry expert, specializing in hermetic interconnect products and is based in Leicester, United Kingdom – with 36+ years of experience in Technical Sales, Sales Engineering and Sales Management.
Olaf is an aerospace electro-mechanical components industry expert, based in Mannheim, Germany – with 26+ years’ experience in Sales/Key-Account Management, Business Development and Product Management with a B.Eng. in Mechanical Engineering from Düsseldorf University of Applied Sciences. Olaf is Fluent in English and German.
Since 1945, Hermetic Seal has been the go-to premier designer and manufacturer of high-reliability custom hermetically sealed electrical interconnection devices. Our products are used in sensing and actuating systems by the aerospace and defense, oil and gas, and medical device industries worldwide.
Hermetic Seal products include qualified military connectors, high-pressure, high-temperature (HPHT) bulkhead connectors, very high-temperature connectors, and ruggedized connectors that combine glass seals with advanced PEEK (polyetheretherketone) molding technology.
Sealtron is the world’s most focused, responsive, and experienced circular hermetic connector manufacturer providing qualified commercial and MIL-STD connectors for a wide range of applications. Our products are manufactured to the highest industry standards making Sealtron your go-to partner when you need highly qualified, high volume hermetic seal connectors.
The Sealtron factory is Qualified Products Listed (QPL’d) on the most significant Mil spec glass-to-metal-sealed connector types in the aerospace industry.
Aegis has established a reputation as the leading designer and manufacturer of hermetic packages in the world. AMETEK Aegis has built a team of dedicated professionals whose expertise in the metal hermetic package industry is unrivaled.
Combined with a world-class manufacturing facility, our engineering and manufacturing skills enable us to make industry standard glass-to-metal-seal packages (Flatpacks, Plug-ins, Platforms) through to the most complex hermetically sealed microelectronic package assemblies, which include DC and RF interconnects, ceramic modules and thermal management materials.